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Marangoni (IPA) Dryer : NEO Series Lift-up Dryer & Swing Dryer

  • Wafer size: 4 ~ 12”
  • Room temperature, watermark free IPA drying process
  • Equipped with unique One-way streaming rinsing capability
  • Advance Marangoni drying capable of efficient particle control on a nano-scale
  • Capable of various substrates (Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz) & thin wafer Processing

Dryer Process Capability:

  • RD Model : DIW Overflow + Dry
  • FRD Model : DHF + DIW Overflow + Dry

NEXTATION Series Automatics Wet Bench

Fully Automated Wet Bench provides versatile process capabilities with particle control on a nano-scale, built on an efficiently small footprint and covers up to 300mm in wafer size, thin wafers, ICS, MEMS, LED, photo masks and glass substrates that use various process chemicals

  • Compact, modular design customised to customer’s requirements
  • Various hardware options: chemical re-circulation, megasonic, chemical concentration monitoring, agitation arm, automatic robot transfer
  • Capable of various process chemistries such as SC1, SC2, HF, BOE, HCI, HF/HNO3, KOH, TMAH, SPM, H3PO4, Solvent
  • Advance software features; process trend monitoring, GUI, SECS/GEM capability
  • Optional subsystems: Hot DIW supply system & chemical delivery or mixing system
  • Equipped with highest safety standards (FM, CE/SEMI Certification, safety interlock)
  • Available in Cassette or Cassetteless configuration that is capable of up to 12” wafer process
Automatic Wet Bench
spindle2_Single wafer tool

SPINEL

SPINEL single wafer processor provides versatile autonomous process capabilities with particle control on a nano-scale and built on an efficiently small footprint and covers up to 300 mm in wafer size, thin wafers, ICS, MEMS, LED, photo masks and glass substrates that use various process chemicals.

  • Various cleaning system: sonic, nano-spray, brush
  • Optimized for low chemical and DI water consumptions
  • Device or wafer protection with Bernoulli chuck (option)
  • Precise chemical control allows improved etching uniformity
  • Compact 3-layer stacking design offers small system footprint
  • Maximum performance achieved through optimized robot and process calibration
  • Equipped with highest safety standards (FM, CE/SEMI Certification, safety interlock, etc)
  • Fume-free design(exhausts are separated by individual chemical zones and automatically controlled)
  • Hardware features: Process chamber cleaning system, chemical recycle function to reduce operation cost
  • Single wafer acid cleaning or etching process such SC1 , SC2, HF, BOE, HCl, HF/HNO3 or solvent lift-off or photoresist stripping process

Spin Scrubber

The autonomous single wafer spin scrubber tool uses DI Water to provide highest particle control capabilities

  • Wafer backside cleaning function
  • Various cleaning system: sonic, nano-spray, brush
  • Compact, modular design optimizes system footprint
  • Device or wafer protection with Bernoulli chuck (option)
  • Precise flow control improved cleaning or chemical efficiency
  • Equipped with highest safety standards (FM, CE/SEMI Certification, safety interlock)
  • Effective single wafer DI Water scrubbing process with option for high pressure spray nozzle
  • Configurate for up to 12” wafer scrubbing process including chemicals such as SC1 , SC2, HF, BOE, HCl, HF/HNO3, DSP & Solvent

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