TLG | FOUP/FOSB Cleaner

The Xtrim-FC-A300 is a fully automated FOUP/FOSB cleaning system designed for high-volume semiconductor production environments. Engineered for superior cleanliness, fast throughput, and safety compliance, it ensures contamination-free wafer transport throughout the fab.

Equipment Structure	1 Loader, 2 Unloaders	3 Buffer Stages	3 Clean Chambers	3 Vacuum Chambers	Robotic Handling
Key Features	Fully Automated Process	High Compatibility	SEMI S2 / F47 Certified	Superior Process Control	High Throughput

Fully Automated Workflow
- Automated lid opening/closing, internal cleaning, vacuum drying, and dehumidification
- Consistent operation without manual intervention
Broad Compatibility
- Supports multiple FOUP/FOSB formats without the need for mechanical changes
- Simple integration into various fab logistics workflows
Safety & Compliance
- Certified to SEMI S2 and F47 standards
- Designed with comprehensive interlocks and error-prevention protocols
High-Performance Cleaning
- Efficient removal of particles, AMCs (including VOCs), and outgassing residue
- Integrated N₂ purge maintains low humidity inside FOUPs post-clean
High Throughput
- Capable of processing 25–30 containers per hour
- Optimized chamber cycle times and robot coordination maximize efficiency

The Xtrim-FC-M300 is a semi-automatic FOUP/FOSB cleaning system designed for fabs, research facilities, and support areas that require reliable cleaning with greater operational flexibility. Engineered for process performance, equipment safety, and cost-efficiency, the M300 offers configurable options to handle a wide range of wafer transport containers and accessories.

Wafer Size Support	Cycle Time	Drying Methods	Certifications	Compatibility
4" to 12"	30–60 mins/cycle	Hot Air / Infrared Drying	SEMI S2 / F47 Certified	FOUP, FOSB, mask boxes, cassettes, etc.

High Cleaning Efficiency
- Combines pure water heating, high-pressure spray, high-speed centrifugal dewatering, CDA/N₂ purging, and hot air/infrared drying for complete container cleaning and drying
Broad Container Compatibility
- Supports FOUPs, FOSBs, wafer cassettes, mask boxes, and custom carriers from 4″ to 12″
Safety-Driven Design
- Equipped with: DBPS dynamic balance protection, High-temperature interlock control, Foolproof protection systems for operator and system safety
Flexible Chamber Configuration
- Cleaning chamber accommodates 4 or 6 FOUPs per cycle
- Chamber layout is customizable based on user requirements and space constraints
Optimized for Cost & Performance
- Ideal for mid-volume cleaning needs, pilot lines, and tool maintenance operations
- Delivers cleanliness levels compliant with front-end semiconductor requirements at a lower footprint and cost