TLG | Single Wafer

The SC200-B02 delivers exceptional performance for single-wafer cleaning and surface preparation. Designed for 6″ and 8″ wafer applications, this system meets the critical demands of R&D centers, pilot lines, and volume fabs requiring high process control, low particle performance, and superior reliability.

Model	Wafer Size	Wafer Breakage	Up Time	Particle Count	Loader / Unloader	Chemical Recycle
SC200-B02	6" / 8"	≤1 / 10,000	≥95%	≤20 @ 0.20μm	SMIF / Open Cassette	≥95%

Single-Wafer Spin Process
- High-precision control of liquid chemistry, temperature, and flow.
- Optimized for uniform surface treatment and minimal particle generation.
Flexible Modular Design
- Configurable with multiple chambers for clean, etch, rinse, and dry steps.
- Supports sequential or parallel processing based on throughput needs.
Advanced Drying Solutions
- Includes spin-dry module with optional surface tension gradient drying.
- Helps eliminate watermarks and ensures dry-in/dry-out capability.
Efficient Chemical Management
- Closed-loop chemical recycle system built in.
- Minimizes chemical waste and operating costs with ≥95% recovery rate.
Cleanroom-Ready Build
- Compact footprint and ergonomic design.
- Constructed with cleanroom-compatible materials and easy access panels.