TLG | Wet Benches

The BC200-A06 is tailored for 6″ and 8″ wafer applications, meeting the demands of both production fabs and R&D environments. The systems are engineered to deliver low particle performance, high uptime, and maximum process control—built with a level of precision.
Whether you’re processing in cassette, cassetteless, or SMIF environments, the benches are tailored for your exact process.

Model	Wafer Size	Wafer Breakage	Up Time	Particle Count	Loader / Unloader	Dryer
BC200-A06	6" / 8"	≤1 / 10,000	≥95%	≤20 @ 0.16μm	SMIF / Open Cassette	Marangoni

Wafer Support: 6” and 8” sizes, supporting cassette, cassetteless, and SMIF load/unload
Automation Options: Fully-automatic or semi-automatic platforms to suit budget and throughput needs
Drying Technology: Marangoni drying for ultraclean wafer surfaces, reducing watermark formation and improving yield
Process Chemistry: Flexible for SPM, DHF, BOE, SC1, SC2, and more—with tunable chemistry ratios and temperature control
Application Fit: Ideal for pilot lines, university cleanrooms, and small-batch production